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Of a previous study. urlscp partnerID YFLogxKURhttp www opus m inward citedby. American Society of Mechanical Engineers. By continuing to use our website you are agreeing privacy policy. MSEC Interface of alcu microlaminates fabricated by roll bonding | marzyeh moradi language:en

The neAlrich features seem to match grain boundary morphology arrow Fig. International Manufacturing Science and Engineering Conference Volume Materials Properties Applications Systems Sustainable VTA. By continuing to use our website you are agreeing privacy policy. Apache. However there is a considerable difference in deformation behavior and of Al Cu sheets during roll bonding as well peel testing different levels applied current microsheets revealed decreasing trendfor required force with increasing

Pre and post Mortem Microstructure analysis was carried out by performing Orientation Imaging Microscopy OIM across the microformed machine elements aiming to correlate spatially evolved microstructures textures deformation zone with mechanics obtained situ observations given materials system. Higher resolution by electron backscatter diffraction and transmission microscopyare currently underway to clarify the expected consequences of temperature rise in density case terms interdiffusive phenomena. VTA pages doi . f high magni cation image. K. Figure shows EDS maps corresponding to the BSE images presented

This indicates that thenetworklike features seen on Cuside surface by BSE areindeed observations using EDS analysis does not show asigni cant variation morphology and distribution of onAlside for peeled surfaces irrespective applied current during roll bonding. version Leave Your Message x Global Journal of Technology and Optimization Please we will get back shortly. inproceedings title Interface of alcu microlaminates fabricated by roll bonding abstract characteristics an EARB process were studied to understand the underlying physical chemical phenomena that lead strength enhancement when applying electrical current during deformation. Here we examined the effects that arise by current application corresponding to levels of and . Sign into or create your free personal account via Shibboleth What is an access management service that provides single signon protected resources. Picard Mechanical Engineering Research output Chapter Book Report Conference proceeding contribution Abstract Interface characteristics of Cu microlaminates fabricated by Roll Bonding EARB process were studied to understand the underlying physical chemical phenomena that lead strength enhancement when applying electrical current during deformation. Microforming devices including ECAP IE and DD dies plane strain condition were designed fabricated to manifest process outcomes anomalies small lengthscale deformations range imposed strains severe moderate low . microstructure evolution surface roughening sudden failure etc. Unpublished PDF Primary Text Restricted to University of Pittsburgh users only until January